MUBS and Multline display the MoU signed

On May 23, 2024, MUBS and Multilines  International Limited signed a  Memorandum of Understanding (MoU) formalizing a strategic partnership to empower MUBS students, elevate the Ugandan logistics sector, and propel Multilines’ research and development (R&D) program.
In MUBS, the partnership is coordinated by the Faculty of Procurement and Logistics Management. The terms for the MoU including; work placement  opportunities where MUBS students and Faculty will gain invaluable handsome experience through internships,  graduate trainee opportunities, and  open days at Multilines.

MUBS and  Multlines cut cake in celebration of the  collaboration

This is intended to provide the Faculty and students with firsthand exposure to real-world logistics operations to complement
their academic studies.

Multilines’ logistics specialists will play  a part in the curriculum development,  share their expertise in Guest Lectures, and trainings. This will enrich the study experience by incorporating practical industry knowledge alongside theoretical foundations.
MUBS students will be connected with  experienced Multilines professionals who will mentor them and provide support on their academic journey.

This is instrumental in shaping their career development. Students and  Staff will also have an opportunity to collaborate with Multilines’ Research and Development team on industry relevant research projects. This will allow them to apply their academic knowledge to real-world challenges,  fostering innovation within the logistics  sector.
Regular knowledge exchange programs will be established to foster continuous learning and collaboration. This will ensure both Institutions remain at the forefront of the ever-evolving logistics landscape.
The MOU signing ceremony took place at MUBS Main Campus, Nakawa and both Institutions are confident that this partnership will have a  transformative impact on MUBS students, the Ugandan logistics industry, and Multilines’ Research and Development program.